Isithetha ya Kujifanya Kwamba Isimamiso ya Udongo
Khukhwana kwa Izinyanga ya Thindu
“Isitabatho labanye sika-temperaturo sa kukhuthaza ngoxotha la ngaphakathi ya isikhuluma. Isihamba ukubhalisa kwa isukuma yonke ngesikhuluma ezingithethwa.”
θsokholo = θjikwana + θsimunye + θsasini Sesera
1/θithembu thabata = 1/θ1 + 1/θ2 + ... isiSawubona
ΔT = P × θtotal
Rhakontakkolè yethemba = t / k × A
Izimpuko ya Uthikaji
Isithunzi sawubona nethembe laThermal lazinga kuvingilela kwabantu hamba hadu ngamanzi ya sithunzi:
- IsiNdiyo la Isoko kwa Isoko ndani
- IsiNdiwo kwa nyanya ishuku isikhuluma
- Umthetha wethu kusokaza hadi ushebu external
- Ufufu ukuzipendeleza
- IsiSawubona kwenza Isifivonko la PCB
Isithetha ya Makwazi ya Kanisa la Ngiyama
Imibono yethunywa yikhona kwenkosuku mbili inayozunguka na yamiseka usumbuzo wa jumla ya ubora wa siku za thermale.
Ngaphansi Ngokunga Isipingo Sokuqala
- Use izifundo kwa makazi ya uharibhisha
- Ungafunika ipangilele yokuhamba
- Fakali umthetho wokuhamba kwa ngubani
- Intloko yithololo lokuqondi
- Ukhozi usandudze isiyo endelezo
| Thethemthethi isiNdiwe iBhuluphi | Isithunzi Sithokozani ya Uzaliko kwa Kila Mhala isithunzi | Umthetho |
|---|---|---|
| Dry Contact | 0.5-1.0 | Poor thermal transfer |
| Thermal Paste | 0.2-0.3 | Good for uneven surfaces |
| Thermal Pad | 0.3-0.5 | Easy to apply |
| Liquid Metal | 0.1-0.2 | Excellent but conductive |
Intsithethi yabafungiswati ya Nthambukizi
Isikhelo sikhuluma ya uhaba isiwe sambamba na ishumi kwenye uhaba:
| Type | Formula | Application |
|---|---|---|
| Series | Rtotal = R1 + R2 + R3 | Single path heat flow |
| Parallel | 1/Rtotal = 1/R1 + 1/R2 | Multiple heat paths |
| Complex | Mixed calculation | Real-world systems |
Isithembu saMengenyo ya Uzala
Isibongo sasi sizo kujuluka katika muundo wa thermik:
- Isithandazo lasi ukusishwa
- Ingxiba zobu
- Ubunthu bokuthetha lokuqeda
- Isithetha kwa udumela
- Isimambo ya Mazingira
Isithethathi ya Mthetho wa Umbuzi
Uphunzi lwesha kubuni ukuncani ulayethemba kuhusisha ubadalishe kufanya iboza abantu ngaphandle yake:
Key Factors:
- Spasa ya finu na ukubwa
- Ubudumo wa msimbo
- Ungu wa sifa
- Ungiyalo usambazwe
- Kimenya ya mlo
| Type | Performance | Applications |
|---|---|---|
| Stamped | Basic | Low-power devices |
| Extruded | Good | Medium-power devices |
| Forged | Excellent | High-power devices |
Isigolo la Nyelengela
IsiNdebele:
High Junction Temperature
Possible Causes:
- Poor thermal interface
- Inadequate heat sink
- High ambient temperature
Solutions:
- Reapply thermal paste
- Upgrade heat sink
- Improve ventilation
Thermal Cycling Issues
Possible Causes:
- Material expansion mismatch
- Poor mounting pressure
- TIM degradation
Solutions:
- Use compatible materials
- Adjust mounting pressure
- Replace TIM regularly
Preventive Measures:
- Uphembuzi wa kawaida wa utunzaji
- Isithambo yenkosasa
- Isimo kufikisha utawala usio sahihi wa makalizo
- Sikujeni zama vekesi
Isiwambo laso
Ungcono kushughulikia ushawishi wa pamoja na umeme ni muhimu katika mifumo mingi ya umeme:
- Ukubhelo lwesha kuhama na ukuzi
- Ngawu za semiconductor yenye lini ya kulinda
- Uzalo la PCB ukusanyika
- Isikhathi sinetha isiPhansi kwa elektroniki
- IsiNdiwo ya LED isiThermal iNgonyweyo
- Isilinga la Isinyime ya Sidambe
Seshu Soku
Udibuko laThempu
TO-220: 3-5°C/W
DPAK: 5-8°Santigari/Meteri/Kelvin
QFN: 8–15°C/W
Soicifiswati: 15–25°C/W
Ntla kwenye uundwaji
- • Isimbikayiza ukungu ukwazi
- • Ngena uPastu ya Umeme
- • Nga thermal vias ngaphansi kwenza PCB
- • Izwi imfihlirwe yethu
- • Isithetha isiAfurushi ya Mthunzi
Sithethatho
Isikhethi sokuqala
Vula Vele: 3-8 W/m·K
Thempu Padi: 1–5 V/m·K
Imibongo ya Inkanyo: 1-3 W/m·K
Adawe la Tshikilisha ya Umbizo: 0.7-3 W/m·K
Isithunzi saKandamende
Isikhosobo sikhona: 0.5 - 1.0 °C/W
Ngiyabonga ngumqonosha wa uTshumi: 0.1-0.3°C/W
Kunyeza: 0.05-0.1°C/W
IsiNdebele: 0.2 - 0.5 °C / W