PCB Temperature Rise Calculator
Understanding PCB Thermal Design
1. Basic Principles
PCB thermal management involves copper area, thermal vias, and layer stacking to effectively dissipate heat from components.
ΔT = P × θja
θja = 1 / (h × A)
Rvia = L / (k × A × N)
Rcu = L / (k × W × t)
Common Questions
What is PCB Temperature?
PCB temperature refers to the operating temperature of printed circuit boards during operation and manufacturing processes. It affects reliability, performance and lifetime of electronic components.
PCB Temperature Limits
| Parameter | Temperature Range | Notes |
|---|---|---|
| Operating Temperature | -40°C to +85°C | Commercial grade |
| Storage Temperature | -55°C to +125°C | Non-operating |
| Soldering Temperature | 230-260°C | Lead-free process |
Best Temperature for Soldering PCB
Recommended soldering temperatures:
- Lead-based solder: 315-330°C
- Lead-free solder: 350-370°C
- Reflow peak: 235-250°C
- Hand soldering: 300-350°C
- Maximum exposure: 10-30 seconds
2. Key Parameters
Important PCB thermal parameters:
- Copper Area
- Copper Thickness
- Thermal Vias
- Layer Count
- Board Material
- Component Power
3. Design Factors
Consider these factors in PCB thermal design:
- Component Location
- Copper Distribution
- Via Pattern
- Layer Stack-up
- Air Flow
- Space Constraints
4. Optimization Tips
Tips for optimizing PCB thermal performance:
- Maximize Copper Area
- Use Thermal Vias
- Consider Inner Layers
- Optimize Component Placement
- Add Thermal Relief
- Consider Heat Spreading
PCB Storage and Handling
PCB Storage Temperature and Humidity
| Condition | Requirement | Duration |
|---|---|---|
| Short-term Storage | 20-30°C, 30-60% RH | <6 months |
| Long-term Storage | 15-25°C, 40-50% RH | >6 months |
| Transportation | -10-40°C, <85% RH | <72 hours |
Troubleshooting Guide
PCB Temperature Standards
| Standard | Description | Requirements |
|---|---|---|
| IPC-2221 | Generic PCB Design | • Temperature ratings • Thermal management • Design guidelines |
| IPC-4101 | Base Materials | • Tg specifications • Thermal properties • Material grades |
| J-STD-020 | Moisture Sensitivity | • Reflow profiles • Storage conditions • Baking requirements |
Industry Standards
Temperature Testing Standards
- IPC-TM-650 2.4.24: Glass Transition Temperature
- IPC-TM-650 2.4.25: Time to Delamination
- IPC-9701: Temperature Cycling
- MIL-STD-883: Thermal Testing
- JEDEC JESD22-A104: Temperature Cycling
Compliance Requirements
- RoHS: Lead-free soldering temperatures
- UL 796: Operating temperature ratings
- IEC 61189: Test methods for materials
- ISO 9455-17: Thermal properties testing
- ASTM D3850: Thermal analysis methods
Industry Standards
Temperature Testing Standards
- IPC-TM-650 2.4.24: Glass Transition Temperature
- IPC-TM-650 2.4.25: Time to Delamination
- IPC-9701: Temperature Cycling
- MIL-STD-883: Thermal Testing
- JEDEC JESD22-A104: Temperature Cycling
Compliance Requirements
- RoHS: Lead-free soldering temperatures
- UL 796: Operating temperature ratings
- IEC 61189: Test methods for materials
- ISO 9455-17: Thermal properties testing
- ASTM D3850: Thermal analysis methods
Documentation Requirements
Required temperature-related documentation:
- Material datasheets with Tg values
- Thermal test reports
- Temperature profile records
- Storage condition logs
- Thermal simulation results