SMD Inductor Code Calculator

Understanding SMD Inductor Codes

1. Coding Systems

SMD inductors use various coding systems to indicate their inductance values and specifications. The most common systems include:

  • EIA (Electronic Industries Alliance) System
  • IEC (International Electrotechnical Commission) System
  • Manufacturer-specific codes
  • Direct value marking

2. EIA Code Format

The EIA coding system uses a three or four-character code:

  • First two digits: Significant figures
  • Third digit: Multiplier (power of 10)
  • Optional fourth character: Tolerance code
  • Example: "102K" = 1.0 × 10² μH ±10%

3. Package Sizes

Common SMD inductor package sizes include:

  • 0402 (1.0mm × 0.5mm)
  • 0603 (1.6mm × 0.8mm)
  • 0805 (2.0mm × 1.25mm)
  • 1008 (2.5mm × 2.0mm)
  • 1210 (3.2mm × 2.5mm)

4. Selection Criteria

Key factors in SMD inductor selection:

  • Inductance value and tolerance
  • DC resistance (DCR)
  • Saturation current rating
  • Self-resonant frequency (SRF)
  • Operating temperature range
  • Shielding requirements

5. Applications

SMD inductors are widely used in:

  • Power supplies and voltage regulators
  • RF and wireless circuits
  • EMI/RFI filtering
  • Signal conditioning
  • Battery charging circuits

6. Design Considerations

Important aspects in SMD inductor implementation:

  • PCB layout optimization
  • Thermal management
  • EMI/EMC compliance
  • Cost and availability
  • Reliability requirements

7. Marking Systems

Detailed explanation of marking systems:

SystemFormatExampleNotes
EIA-963-digit code220 = 22μHMost common
IECμH direct22μ = 22μHEuropean std
JISLetter code22K = 22μHJapanese std

8. Performance Parameters

Critical performance specifications for SMD inductors:

ParameterTypical RangeImpact
Q Factor20-100Efficiency, bandwidth
SRF100MHz-1GHzMaximum usable frequency
DCR0.01-1ΩPower loss, heating

9. Core Materials

Common core materials and their characteristics:

  • Ferrite Cores:
    • High permeability: 500-15000
    • Good for high frequency
    • Temperature stable
    • Cost effective
  • Iron Powder Cores:
    • Lower permeability: 10-100
    • Better saturation handling
    • Suitable for power applications
    • Good cost/performance ratio

10. Reliability Factors

Key reliability considerations:

  • Environmental Factors:
    • Temperature cycling resistance
    • Humidity resistance
    • Mechanical shock tolerance
    • Vibration resistance
  • Electrical Stress:
    • Current derating
    • Voltage isolation
    • Surge handling
    • EMI immunity

11. Selection Guide

Systematic approach to SMD inductor selection:

StepConsiderationsCritical Parameters
1. Application Requirements
  • Operating frequency
  • Current requirements
  • Space constraints
  • Inductance value
  • Peak current
  • Package size
2. Performance Analysis
  • Core material selection
  • Shielding requirements
  • Temperature rise
  • Q factor
  • SRF
  • DCR
3. Environmental Factors
  • Operating temperature
  • Mechanical stress
  • EMI requirements
  • Temperature rating
  • Mounting method
  • Shielding type

Additional selection considerations:

  • Cost and Availability:
    • Budget constraints
    • Supply chain reliability
    • Alternative sources
    • MOQ requirements
  • Manufacturing Considerations:
    • Assembly process compatibility
    • Reflow soldering profile
    • Moisture sensitivity level
    • Handling requirements
  • Quality and Reliability:
    • Manufacturer reputation
    • Qualification requirements
    • Expected lifetime
    • Failure rate specifications

12. Troubleshooting Guide

Common issues and solutions in SMD inductor applications:

IssuePossible CausesSolutions
Excessive Heating
  • Current exceeding rating
  • Poor thermal design
  • High ambient temperature
  • Verify current requirements
  • Improve thermal management
  • Consider larger package size
EMI Problems
  • Insufficient shielding
  • Poor PCB layout
  • Wrong core material
  • Use shielded inductors
  • Optimize PCB layout
  • Select appropriate core
Value Drift
  • Temperature effects
  • Core saturation
  • Mechanical stress
  • Use stable core material
  • Check operating conditions
  • Improve mounting method

Additional troubleshooting considerations:

  • Assembly Issues:
    • Solder joint reliability
    • Component placement accuracy
    • Thermal stress during reflow
    • Handling damage
  • Performance Issues:
    • Frequency response problems
    • Q factor degradation
    • Impedance matching issues
    • Core saturation effects
  • Reliability Issues:
    • Environmental stress failures
    • Long-term stability
    • Moisture sensitivity
    • Thermal cycling effects

Quick Reference

EIA Format

Value = XY × 10^Z μH

Tolerance Codes

F: ±1%, G: ±2%, J: ±5%, K: ±10%, M: ±20%

R Notation

"R" represents decimal point